ALD (thermal ALD/PEALD/spatial ALD)
BOTTLENECKASMI leads spatial ALD and GAA transistors require three to four times more steps than FinFET, straining qualified tool supply during the node transition.
Atomic layer deposition for ultra-thin conformal films: gate dielectrics, barriers, high-k metal gates. GAA transistors require 3-4x more ALD steps than FinFET, driving tool demand. ASMI, Applied Materials, Lam, TEL compete; ASMI leads spatial ALD.
What the evidence shows
Leading ALD companies include ASM, Tokyo Electron, Lam Research, Applied Materials, Jusung Engineering, NAURA, Mattson, Oxford Instruments, and Beneq.
reports.valuates.comThermal ALD held approximately 53% market share in 2023, remaining the foundation for numerous applications.
marketgrowthreports.comWho controls it
Where it sits in the stack
Related nodes
Full scorecard, owner shares, supply edges and the full tracked roster are in the desk letter.
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