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10 layers580 nodes2,376 dependencies9 chokepoints112 bottlenecks6,500+ companiesnode size = companies identified

Pure-play leading-edge logic foundries (sub-5 nm)

BOTTLENECK

TSMC alone runs sub-5 nm logic at scale, locking AI-chip customers into multi-year supply deals with no qualified second source until at least the late 2020s.

Contract fabs manufacturing at 3 nm, 2 nm, and below with gate-all-around transistor architectures. Sole commercial source for the most advanced AI processors through approximately 2027. TSMC holds near-monopoly pricing power and locks customers into long-term supply agreements.

What the evidence shows

TSMC holds ~90%-plus share of sub-5nm logic where the entire AI profit pool sits.

investmentcase.substack.com

Demand for leading-edge nodes currently exceeds supply by a wide margin.

semiengineering.com

Samsung offers 3nm GAA with a roadmap to 2nm and high-volume EUV capacity, evaluated as a strategic second source.

latterly.org
RESCORED JUL 2026near-monopolyscaling4 companies

Who controls it

TSMCSamsung FoundryIntel Foundry+1 more tracked

No independently verified market-size figure is published for this node yet.

Where it sits in the stack

Takes in: Fabless/IDM chip design, PDKs, photomasks, EUV-exposed wafers

Sends on: Leading-edge logic wafer with complete transistor stack; wafer-sorted known-good die

19 upstream · 4 downstream

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Related nodes

Leading-edge memory fabs - DRAM and HBMLeading-edge memory fabs - 3D NAND flashEstablished/mid-range logic foundries (7-28 nm)Mature/trailing-edge logic foundries (40 nm - 350 nm)Specialty process foundriesIntegrated device manufacturers (IDMs)

Full scorecard, owner shares, supply edges and the full tracked roster are in the desk letter.

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