IC packaging substrates
BOTTLENECKNittobo's control of T-glass cloth constrains ABF substrate output, with new capacity not arriving until 2027 and a deficit projected from H1 2026.
Multi-layer organic, glass, or ceramic substrates providing die-to-board interconnect for packaged AI chips. Layer count and wiring density limit I/O bandwidth and power delivery to accelerators. Unimicron leads ABF supply with the top five holding ~74%; the hard constraint is Nittobo’s ~90% grip on T-glass cloth, with new capacity not online until 2027 and an ABF deficit projected from H1 2026.
What the evidence shows
Protracted qualification cycles of 12–18 months inhibit rapid substitution when supply tightens.
indexbox.ioZhen Ding is committing over US$1 billion by 2027 to become a global supplier of high-end substrates.
yolegroup.comWho controls it
No independently verified market-size figure is published for this node yet.
Where it sits in the stack
Takes in: ABF dielectric film (Ajinomoto sole ABF film supplier), T-glass fibre cloth, copper foil, laser via drilling
Sends on: High-layer-count organic or glass substrate for flip-chip packaging
Related nodes
Full scorecard, owner shares, supply edges and the full tracked roster are in the desk letter.
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