Deposition equipment

Three companies supply the world's deposition tools, and ALD capacity must scale tightly with each new GAA layer.

Tools deposit thin films via CVD, ALD, PVD, epitaxy, and electrochemical methods. Every transistor layer needs deposition, and step counts rise at advanced nodes. Applied Materials, Lam Research, and TEL lead; ALD is critical at GAA nodes.

Tools depositing thin films on wafers by chemical vapour deposition (CVD), atomic layer deposition (ALD), physical vapour deposition (PVD), epitaxy, and electrochemical deposition; each sub-type serves distinct film and process needs.

What the evidence shows

Normalized lead time for etch and deposition is three to six months, but currently in six plus months territory.

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RESCORED JUL 2026oligopolyscaling

Who controls it

Tokyo ElectronLam ResearchApplied Materials

No independently verified market-size figure is published for this node yet.

Where it sits in the stack

Takes in: Process gases, precursors, silicon wafers

Sends on: Wafer with deposited dielectric, metal, or epitaxial film

depends onSputtering targets Electronic-grade specialty gases RF power delivery Mass flow controllers (MFCs) and gas delivery

feeds intoWafer fabrication - foundries and IDMs 3D-IC - SoIC/wafer-on-wafer/die-on-wafer hybrid bonding

Related nodes

Lithography systems Etch equipment CMP equipment Ion implantation Thermal processing and anneal Cleaning equipment

Full scorecard, owner shares, supply edges and the full tracked roster are in the desk letter.

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