Lithography systems

ASML's grip on advanced lithography means the resolution ceiling and wafer throughput at leading nodes depend on systems from a single supplier.

Patterning systems projecting circuit designs onto photoresist: EUV, High-NA EUV, DUV immersion, DUV dry, and e-beam. Sets the resolution ceiling for each node; throughput directly constrains wafer output. ASML dominates with roughly 90% of advanced lithography revenue.

Optical and e-beam systems patterning circuit features onto photoresist-coated wafers; covers EUV, High-NA EUV, DUV immersion, DUV dry, and laser anneal tools.

What the evidence shows

Zerodur mirror substrates have lead times of 12-18 months, constraining rapid capacity expansion.

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RESCORED JUL 2026near-monopolyscaling6 companies

Who controls it

ASMLNikonCanon+3 more tracked

$11B market · 20253.74% CAGRsource

Where it sits in the stack

Takes in: Photomasks/reticles, photoresist-coated wafers, optical components

Sends on: Exposed (patterned) wafer ready for develop/etch

depends onPhotomask and reticle supply chain Wet chemicals and electronic-grade acids/bases Fab subsystems and components Industrial metals Specialty and industrial gases Coat/develop track (photoresist processing)Merchant mask shops Photoresists and lithography chemicals

feeds intoPure-play leading-edge logic foundries (sub-5 nm)Leading-edge memory fabs - DRAM and HBM Established/mid-range logic foundries (7-28 nm)Mature/trailing-edge logic foundries (40 nm - 350 nm)Overlay metrology

Related nodes

Deposition equipment Etch equipment CMP equipment Ion implantation Thermal processing and anneal Cleaning equipment

Full scorecard, owner shares, supply edges and the full tracked roster are in the desk letter.

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