Thermo-compression and hybrid-bonding tools

Hanmi Semiconductor supplies precision bonders and tool capacity constraints limit HBM and advanced packaging output.

Precision bonders join die using heat and force. Thermocompression bonding stacks HBM memory; hybrid bonding enables sub-10-micron 3D integration. Tool capacity limits HBM and advanced packaging output.

Precision bonders placing and bonding die under heat and force; covers thermo-compression bonding (TCB) for HBM stacking and chip-on-wafer attach, and direct copper-to-copper hybrid bonders for sub-10-micron-pitch 3D integration.

What the evidence shows

ASM Pacific shipped its 250th thermo-compression bonding tool to customers.

Applied Materials acquired 9% stake in BE Semiconductor for $100M to co-develop hybrid bonding.

mordorintelligence.com

RESCORED JUL 2026oligopolyscaling

Who controls it

Hanmi SemiconductorASMPTEV Group

$116M market · 202515.1% CAGRsource

Where it sits in the stack

Takes in: Known-good die, wafers, NCP/NCF underfill, bonding activation chemistry

Sends on: Bonded die stack or hybrid-bonded wafer/die assembly

depends onLead frames Quartzware and fab consumable parts

feeds into3D-IC - SoIC/wafer-on-wafer/die-on-wafer hybrid bonding HBM stacking - TSV and mass reflow/thermocompression bonding

Related nodes

No other tracked node in the atlas currently shares this parent.

Full scorecard, owner shares, supply edges and the full tracked roster are in the desk letter.

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