Integrated device manufacturers (IDMs)

Few firms control vertically integrated chip manufacturing that co-optimizes process and design, creating supply dependency.

Companies that design and manufacture chips in-house, such as Intel, Samsung, and Texas Instruments. Fabrication assets here refer only to their production operations; design activities are mapped separately. Vertical integration allows process-design co-optimisation, though Intel's IDM 2.0 now blends internal and external foundry capacity.

Companies that both design and fabricate chips in-house; fabrication side only in L5; chip design/architecture cross-tagged to L4.

What the evidence shows

The world’s top 10 IDMs generated US$536 billion in semiconductor sales in 2024.

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Who controls it

IntelSamsungTexas Instruments

No independently verified market-size figure is published for this node yet.

Where it sits in the stack

Takes in: Internal chip design, wafer inputs, fab equipment

Sends on: Packaged devices from internal fabs; also foundry services to external customers

depends onSemiconductor capital equipment Semiconductor materials and consumables

feeds intoAdvanced packaging and OSAT

Related nodes

Pure-play leading-edge logic foundries (sub-5 nm)Leading-edge memory fabs - DRAM and HBM Leading-edge memory fabs - 3D NAND flash Established/mid-range logic foundries (7-28 nm)Mature/trailing-edge logic foundries (40 nm - 350 nm)Specialty process foundries

Full scorecard, owner shares, supply edges and the full tracked roster are in the desk letter.

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