Pellicles
BOTTLENECKAn EUV pellicle must survive scanner power without eating the light, a materials problem so hard that only two suppliers ship qualified membranes.
Protective membrane stretched across the mask surface to block particles from landing on the pattern during exposure. EUV pellicles must survive high-power 13.5 nm radiation with >90% transmission, a materials-science constraint that delayed EUV adoption. Mitsui and S&S Tech share supply; ASML is developing alternatives to ease the bottleneck.
Thin membrane mounted over mask to prevent particle contamination during wafer exposure; EUV pellicles require greater than 90% transmission at 13.5 nm and are technically challenging to manufacture.
What the evidence shows
Qualification cycles for new pellicle designs in high-volume semiconductor fabs extend 12-24 months.
indexbox.ioElevated costs for advanced EUV pellicles create obstacles for smaller manufacturers and startups, limiting new entrants.
giiresearch.comWho controls it
Where it sits in the stack
Takes in: Inspected photomask, pellicle membrane material (polysilicon/SiN)
Sends on: Pellicle-protected mask ready for scanner installation
Full scorecard, owner shares, supply edges and the full tracked roster are in the desk letter.
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