Semiconductor test - ATE, burn-in, and probe
BOTTLENECKTwo vendors dominate ATE supply and longer test times for AI chips create throughput bottlenecks.
Automated test equipment and test operations for functional and parametric testing of packaged or bare die. Longer test times for HBM and AI ASICs create throughput bottlenecks at advanced nodes. Teradyne and Advantest hold ~85%+ ATE market share.
Automated test equipment and test operations for functional and parametric testing of packaged or bare die; covers SoC/logic ATE, memory ATE, wafer probe/sort, burn-in, and wafer-level burn-in.
What the evidence shows
Advantest, Teradyne, and Cohu collectively hold about 55% of the ATE market.
mordorintelligence.comAdvantest virtually monopolizes ATE supply for AI and advanced-node chips.
tspasemiconductor.substack.comHandlers and probers are largely dominated by Japanese firms TEL and Tokyo Seimitsu.
tspasemiconductor.substack.comWho controls it
Where it sits in the stack
Takes in: Packaged or probed die, test program, loadboard/DIB
Sends on: Tested, binned die with known-good designation
Related nodes
Full scorecard, owner shares, supply edges and the full tracked roster are in the desk letter.
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